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Reliability
Updated October
25, 2009
Click
here to go to our main page on heat
New for November 2009!
And we apologize in advance for the lack of content. Microwave electronics
reliability is such a big topic, you can make a career out of it.
That is, if you aren't capable of designing a microwave circuit,
you can take joy in testing others parts to failure.
For now, we'll just throw out
some topics, which we'll get back to in more detail in the future.
If anyone wants to contribute to these topics, or start some new
ones, we would appreciate it! Contact
us.
Eventually, every topic below
will have its own Microwaves101 page.
Life test
Life test of microwave hardware
usually involves accelerating the failures so that it doesn't take
a lifetime to get data. The way to accelerate a life test is to
increase the temperature of the hardware. If mean time to failure
data can be determined at two temperatures, then some simple math
can be done to extrapolate what the MTTF will be at any temperature.
This is a universally accepted idea of life testing.
MTTF: mean time to failure,
used in the context of a repairable system.
MTBF: mean to between failures,
used in the context of a non-repairable system. This what we are
evaluating in a life test.
DCOL: operating lifetime with
DC-only excitation.
RFOL: operating lifetime with
RF (and DC) excitation.
Infant mortality
Failure often occur very early
in the lifetime of an electronic product. These are called infant
mortalities. The mechanisms for infant mortalities are quite different
from end-of-lifetime issues, the former usually due to sloppy workmanship,
the latter usually being related to temperature failure.
In order to eliminate infant
mortalities in hardware, often a burn-in procedure is used, prior
to delivering hardware.
Failure modes
Failure is often a relative term.
In a power amplifier, a failure criteria might be 1 dB reduction
in saturated power, which might be called a "soft" failure.
It all depends on what you can tolerate. Catastrophic failure means
that the part is completely unusable (called a "hard"
failure). Most life tests use a degraded performance criterion.
DC versus RF operating lifetime
The easiest way to perform life
testing is to apply DC power only (no RF) to the hardware, and control
the temperature. DC life test equipment is far cheaper than RF life
test equipment. Often, particularly in RF life test, the equipment
degrades or fails long before the component under test.
Arrhenius plot
The MTTF data are plotted on
a log/log plot of time.
The Arrhenius equation is an
empirical observation of chemical reaction rate versus temperature.
It was first explained by Swede Svante
Arrhenius, in 1884, based on earlier work by Dutch Jacobus
Henricus van 't Hoff.
k=Ae^-[Ea/RT]
where k is the rate constant
Ea is the activation energy,
typically expressed in electron volts
T is in absolute units (degrees
Kelvin)
R is
the ideal gas constant
8.31 J/k-mol
More to come!
Graceful degradation
A topic for another day.
Stress analysis and derating
Stress analysis means considering
all of the components in a circuit, evaluating their dissipated
power, peak voltage, DC current, etc. Typically a spreadsheet is
used. One of these days we'll create an Excel file as an example
of this. The end result are columns that provide indication of stress
levels as a percentage of the derated stress. A smart designer will
be sure not to exceed 100% of ratings, and in military designs,
often you must be less than 50% or ratings.

Derating must be done over temperature,
components can handle a lot more stress at 25C than at 85 C. Usually
the manufacturer will provide derating guidelines, which might amount
to a straight-line curve from 100% at 85C to 0% at 150C
Here's some example components
and the parameters you need to think about:
Resistors: dissipated
power, DC current density (mA/mm), maximum temperature. More
information here.
Capacitors: peak voltage
(includes the sum of RF and DC voltages, and must take into account
VSWR interactions which can double the RF voltage), dissipated power
(yes, capacitors dissipate power, here's
how to calculate it)
Inductors: DC current.
Transistors: maximum dissipated
power density, maximum channel or junction temperature
Transmission lines: DC
current density
MMICs: you can just pretend
that the manufacturer's data sheet tells you the thermal resistance
of the integrated circuit, or you can actually do your own calculation
and know a lot more. We'll post a page on this soon.
Stress testing
Stress testing means applying
a stress to a component, stepping up the stress, applying it again,
while monitoring the device for failure or degradation. That maximum
power that the device can stand without (or with minimal) damage
is called survival power, or power handling.
Classic examples of components
that you might want to subject to stepped stress tests are limiter
circuits, and low noise amplifier circuits. A stepped stress might
consist of:
- Measure baseline small-signal
S-parameters, or noise figure for an LNA
- Expose unit to 10 seconds
of RF power (10 dBm at first, for example)
- Remeasure Small signal S-parameters
- Increase power by 1 dB, return
to step 1.
The failure of a part during
stepped stress may be subtle (and be less than the measurement repeatability),
or catastrophic. Often MMIC suppliers will tell you that their low
noise amplifier will survive exposure to 20 dBm (but rarely will
they put this in writing...) It might "survive", but its
gain might change by one dB or more, and its transmission phase
angle might change 10 degrees. In a cell phone, you might not care
about this. But in a radar pre-monopulse
receiver, 1 dB or 10 degree changes might ruin the monopulse null
depth. So you have to carefully consider what "survival power"
means in your application.
The power handling of a low noise
amplifier might be very different in biased (on) and unbiased (off)
states. It seems intuitive that the power handling might be higher
in the unbiased state, because the input would not be well matches,
and therefore a larger fraction of the incident power would be reflected.
However, it is always best to evaluate the power handling in the
state where high incident power is required, and that often means
measurements in both states.
So, how much power handling can
you expect an LNA to provide? The is is heavily dependent on the
technology platform, the geometry of the first stage transistor,
and the bias circuitry. As a general rule of thumb, a GaAs pHEMT
LNA might be good for 50 milliwatts (17 dBm), while a GaN HEMT LNA
will be good for 500 milliwatts. If anyone has some measured data
to contribute, we'd appreciate it!
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