|
Thermal
analysis
Updated October
16, 2009
Click
here to go to our main page on heat
New for November 2007! Thermal
analysis is important in electronics, because reliability is related
intimately to temperature. So much that these two often have
an illegitimate child, named "Failure"!
Heat flow can be enabled by conduction,
convection, and radiation. In electronics we usually rely on conduction
and convection, unless we are designing for a space application
where heat can only exit the payload via radiation.
Steady state analysis
Steady-state implies that the
equipment has heated up enough so that the temperature along the
heat path is no longer varying with time. In the analysis, you need
a heat source, and a heat sink. The heat sink is usually considered
to operate at a fixed temperature.
Transient analysis
Transient analysis is a much
harder problem to analyze than steady state. Heat flow by conduction
is governed by a partial differential equation, which is called
Fourier's Law.
dQ/dt=-kdT/dx
where k is the thermal conductivity
of the material. Its S. I. units are W/m-K
Fourier's law is an empirical.
It states that the rate of heat flow, dQ/dt, through a homogeneous
solid is directly proportional to the area, A, of the section at
right angles to the direction of heat flow, and to the temperature
difference along the path of heat flow, dT/dx. It requires knowledge
of initial conditions in order to predict what happens over time.
It also depends on the thermal resistance of the material, k. There
are few examples of Fourier's equation being solved to a closed
form expression, however, partial differential equations are quite
solvable using numerical integration techniques, which is what computers
were invented for.
The numerical integration of
Fourier's Law is easy to understand in transient analysis where
heat flows in just one dimension, of you apply conservation of energy,
the first law of thermodynamics. For a thin slab of material, the
heat into one face plus the heat generated within the slab must
be equal to the heat out of the other face, plus the heat stored
in the slab (what goes in, must come out). This "heat stored"
term is where the heat capacity of teh material comes in.
More to come!
|